Single-and dual-chamber module-attachable wafer-handling chamber

ABSTRACT

A single- and dual-chamber module-attachable wafer-handling chamber includes: a wafer-handling main chamber equipped with a wafer-handling robot therein, and adaptors for connecting process modules to the wafer-handling main chamber. The adaptors are detachably attached to the sides of the wafer-handling main chamber, respectively, and the process modules are detachably attached to the adaptors, respectively, so that the process modules can be attached to the wafer-handling main chamber, regardless of whether the process modules are of a single-chamber type or dual-chamber type.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to a wafer-processing apparatus, particularly to a wafer-handling chamber to which both a single-chamber module and a dual-chamber module can be attached.

2. Description of the Related Art

In order to increase a throughput of a wafer-processing apparatus, the wafer-processing apparatus is equipped with dual process modules as disclosed in co-pending U.S. patent application Ser. No. 13/154,271 (published as U.S. patent application publication No. 2012/0305196). In the wafer-processing apparatus, a process module including dual reaction chambers disposed side by side is attached to each side of the wafer-handling main chamber which is polygonal. However, if the process modules are not commonly standardized, they are not connectable to the same polygonal wafer-handling main chamber. For some processes, a process module needs a certain length or width which are not adjusted, and thus, such a process module is not standardized as other modules can be.

Further, in such a wafer-handling main chamber equipped with dual-chamber process modules, in order to tentatively increase the capacity of the reaction chamber and/or modify the configurations as an experiment to see improvement of performance, it is required to produce a new dual-chamber process module having two new reaction chambers, raising the cost. Also, in order to tentatively increase the size of the reaction chamber or modify the process which requires size modifications, a dual-chamber process module needs to be modified to be a single-chamber process module, and then, a new wafer-handling main chamber is required, or significant modifications are required to accept the single-chamber process module.

Any discussion of problems and solutions involved in the related art has been included in this disclosure solely for the purposes of providing a context for the present invention, and should not be taken as an admission that any or all of the discussion were known at the time the invention was made.

SUMMARY OF THE INVENTION

Some embodiments provide a single- and dual-chamber module-attachable wafer-handling chamber which can solve at least one of the problems or any other problems, which wafer-handling chamber comprises:

-   -   a wafer-handling main chamber having a polygonal shape having         multiple sides for connecting process modules thereto,         respectively, and one additional side for a load lock chamber,         wherein each process module has a single reaction chamber or         dual reaction chambers, and each of the multiple sides has a         single opening for communicating with the process module         connected thereto and has a width sufficient to accommodate two         reaction chambers;     -   a wafer-handling robot installed inside the wafer-handling main         chamber for transferring wafers between chambers connected to         the wafer-handling main chamber, said wafer-handling robot being         accessible to each of the chambers connected to the         wafer-handling main chamber; and     -   adaptors for connecting the respective process modules to the         wafer-handling main chamber wherein the process modules are not         connectable to the wafer-handling main chamber without the         adaptors, each adaptor having an inner face and an outer face,         wherein the inner faces are detachably attached to the multiple         sides of the wafer-handling main chamber, respectively, and the         outer faces are adapted to detachably attach the process modules         thereto, respectively, and each adaptor has a single opening for         the process module having a single reaction chamber or two         openings for the process module having dual reaction chambers so         that wafers can be transferred using the wafer-handling robot         between the wafer-handling main chamber and the process modules         through the openings of the adaptors and the openings of the         multiple sides of the wafer-handling main chamber when the         process modules are connected to the multiple sides of the         wafer-handling main chamber, respectively, via the respective         adaptors.

Accordingly, an adaptor system is provided wherein both a dual-chamber module (DCM) and a single-chamber module (SCM) can be installed to multiple sides of a polygonal wafer-handling main chamber.

In some embodiments, the outer face of at least one adaptor is inclined for attaching a process module thereto at an angle other than a right angle, wherein the angle is defined by an axis of the process module and the inner face of the adaptor as viewed from above, so that design freedom is further increased wherein process modules can be installed without interfering with maintenance work and/or without conflicting with other chambers and modules such as a load lock chamber and an equipment front end module.

In another aspect, the adaptor system provides a single- and multiple chamber module-attachable wafer-handling chamber, where the module can have not only one or two but also three or more chambers. Substantially the same technology as in the single- and dual-chamber module-attachable wafer-handling chambers can be applied to the single- and multiple-chamber module-attachable wafer-handling chambers, except that the number of openings formed in the adaptor is increased according to the number of chambers included in the module. Some embodiments providing a single- and multiple-chamber module-attachable wafer-handling chamber include: a polygonal wafer-handling main chamber equipped with a wafer-handling robot therein, and adaptors for connecting process modules to the wafer-handling main chamber, wherein the adaptors are detachably attached to sides of the wafer-handling main chamber, respectively, and the process modules are detachably attached to the adaptors, respectively, so that the process modules can be attached to the wafer-handling main chamber, regardless of whether the process modules are of a single-chamber type or dual-chamber type.

Some embodiments further provide a wafer-processing apparatus, comprising: any of the single- and dual-chamber module-attachable wafer-handling chambers disclosed herein, and process modules attached to the adaptors, respectively.

Some embodiments also provide an adaptor for connecting a process module having a single reaction chamber or dual reaction chambers to a wafer-handling main chamber having multiple sides, to one of which the process module is connected, and said one of which has a single opening for communicating with the process module connected thereto and has a width sufficient to accommodate two reaction chambers, wherein the adaptor has an inner face and an outer face, wherein the inner face is detachably attachable to the one side of the wafer-handling main chamber, and the outer face is detachably attachable to the process module, said adaptor having a single opening for the process module having a single reaction chamber or two openings for the process module having dual reaction chambers so that a wafer can be transferred between the wafer-handling main chamber and the process module through the opening of the adaptor and the opening of the one side of the wafer-handling main chamber.

For purposes of summarizing aspects of the invention and the advantages achieved over the related art, certain objects and advantages of the invention are described in this disclosure. Of course, it is to be understood that not necessarily all such objects or advantages may be achieved in accordance with any particular embodiment of the invention. Thus, for example, those skilled in the art will recognize that the invention may be embodied or carried out in a manner that achieves or optimizes one advantage or group of advantages as taught herein without necessarily achieving other objects or advantages as may be taught or suggested herein.

Further aspects, features and advantages of this invention will become apparent from the detailed description which follows.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features of this invention will now be described with reference to the drawings of preferred embodiments which are intended to illustrate and not to limit the invention. The drawings are greatly simplified for illustrative purposes and are not necessarily to scale.

FIG. 1 is a schematic diagram of a plasma CVD apparatus according to an embodiment of the present invention.

FIG. 2 schematically illustrates various adaptors attachable to a wafer-handling main chamber according to some embodiments.

FIG. 3 is a schematic view of a wafer-processing apparatus according to an embodiment of the present invention.

FIG. 4 is a schematic view of a wafer-processing apparatus according to another embodiment of the present invention.

FIG. 5 is a schematic view of a process module attached to an adaptor wherein a half-U-shaped top arm is inserted according to an embodiment of the present invention.

FIG. 6 schematically illustrates movement of a half-U-shaped top arm in a reaction chamber attached to a wafer-handling main chamber using a flat adaptor having an opening on the right side ((a) in FIG. 6) and in a reaction chamber attached to a wafer-handling main chamber using an angled adaptor having an opening on the right side ((b) in FIG. 6) according to an embodiment of the present invention.

FIG. 7 schematically illustrates movement of a half-U-shaped top arm in a wafer-handling main chamber ((a1) in FIG. 7) and in a reaction chamber attached to a wafer handling main chamber using a flat adaptor having an opening on the right side ((a2) in FIG. 7), and movement of a U-shaped top arm in a reaction chamber attached to a wafer-handling main chamber using a flat adaptor having two openings ((b) in FIG. 7) according to an embodiment of the present invention.

FIG. 8 is a schematic view of a wafer-processing apparatus according to an embodiment of the present invention.

FIG. 9 illustrates schematic views of an adaptor according to an embodiment of the present invention, wherein (a), (b), and (c) are a rear perspective view (partially transparent), cross section taken along line b, and front perspective view of the adaptor, respectively.

FIG. 10 is a schematic partial view of a connecting portion of an adaptor which is attached to a wafer-handling chamber according to an embodiment of the present invention.

FIG. 11 is a schematic view illustrating connection between a wafer-handling main chamber and a dual-chamber process module via an adaptor according to an embodiment of the present invention.

FIG. 12 is a schematic view illustrating connection between a wafer handling main chamber and a dual-chamber process module via an adaptor according to another embodiment of the present invention.

DETAILED DESCRIPTION OF EMBODIMENTS

In this disclosure, “dual chambers” refers to two sections or compartments fix processing wafers disposed closely to each other and viewed substantially as, e.g., positionally, structurally, functionally, and/or operationally, separated or isolated from each other, which include not only two separate chambers connected to each other side by side or vertically, but also two isolated regions disposed side by side or vertically in one common chamber. In this disclosure, a “module” refers to a standardized unit detachably attachable to a wafer-handling main chamber. Also, in this disclosure, “the invention” or “the present invention” refers to at least one of the embodiments or aspects explicitly, necessarily, or inherently disclosed herein. In this disclosure, an article “a” refers to a species or a genus including multiple species. Further, in this disclosure, any two numbers of a variable can constitute an workable range of the variable as the workable range can be determined based on routine work, and any ranges indicated may include or exclude the endpoints. Additionally, any values of variables indicated may refer to precise values or approximate values and include equivalents, and may refer to average, median, representative, majority, etc., in some embodiments.

In the present disclosure where conditions and/or structures are not specified, the skilled artisan in the art can readily provide such conditions and/or structures, in view of the present disclosure, as a matter of routine experimentation. In all of the disclosed embodiments, any element used in an embodiment can be replaced with any elements equivalent thereto, including those explicitly, necessarily, or inherently disclosed herein, for the intended purposes. Further, the present invention can equally be applied to apparatuses and methods.

In this disclosure, any defined meanings do not necessarily exclude ordinary and customary meanings in some embodiments.

As discussed above, in some embodiments, the present invention provides a single- and dual-chamber module-attachable wafer-handling chamber, comprising: (i) a wafer-handling main chamber having a polygonal shape having multiple sides for connecting process modules thereto, respectively, and one additional side for a load lock chamber, wherein each process module has a single reaction chamber or dual reaction chambers, and each of the multiple sides has a single opening for communicating with the process module connected thereto and has a width sufficient to accommodate two reaction chambers; (ii) wafer-handling robot installed inside the wafer-handling main chamber for transferring wafers between chambers connected to the wafer-handling main chamber, said wafer-handling robot being accessible to each of the chambers connected to the wafer-handling main chamber; and (iii) adaptors for connecting the respective process modules to the wafer-handling main chamber, each adaptor having an inner thee and an outer face, wherein the inner faces are detachably attached to the multiple sides of the wafer-handling main chamber, respectively, and the outer faces are adapted to detachably attach the process modules thereto, respectively, and each adaptor has a single opening for the process module having a single reaction chamber or two openings for the process module having dual reaction chambers so that wafers can be transferred using the wafer-handling robot between the wafer-handling main chamber and the process modules through the openings of the adaptors and the openings of the multiple sides of the wafer-handling main chamber when the process modules are connected to the multiple sides of the wafer-handling main chamber, respectively, via the respective adaptors.

In some embodiments, all of the adaptors have a single opening, and the single opening is disposed in a center of each adaptor, or the single opening is disposed aside from a center of each adaptor. All of the adaptors can be of the same type or can be of different types in any combination disclosed in this disclosure. In some embodiments, all of the adaptors have dual openings, and the dual openings are disposed symmetrically.

In some embodiments, the outer face of at least one adaptor is inclined for attaching a process module thereto at an angle other than a right angle, said angle being defined by an axis of the process module and the inner face of the adaptor as viewed from above. In some embodiments, at least one adaptor has a uniform thickness from one end of the adaptor to another end of the adaptor as viewed from above. In some embodiments, an angle defined by an axis of the process module attached to one of the multiple sides of the wafer-handling main chamber and an axis of the process module attached to another of the multiple sides of the wafer-handling main chamber next to the one of the multiple sides of the wafer-handling main chamber as viewed from above, is smaller than an angle defined by a line perpendicular to the one of the multiple sides of the wafer-handling main chamber and a line perpendicular to the another of the multiple sides of the wafer-handling main chamber as viewed from above. Accordingly, design freedom is further increased wherein process modules can be installed without interfering with maintenance work and/or without conflicting with other chambers and modules such as a load lock chamber and an equipment front end module.

In some embodiments, the wafer-handling robot has a half-U-shaped arm connected to an end effector. Alternatively, in some embodiments, the wafer-handling robot has a U-shaped arm having ends connected to end effectors, respectively. In some embodiments, the wafer-handling robot is a double-arm robot.

In some embodiments, each adaptor is provided with a gate valve on the inner surface for closing and opening the opening of the adaptor. En some embodiments, each adaptor has an average thickness of about 50 mm to about 100 mm, which is smaller than a diameter of the wafer. In some embodiments, the adaptors are made of an aluminum alloy, and the process modules are not connectable to the wafer-handling main chamber without the adaptors.

In some embodiments, the wafer-handling main chamber is pentagonal and has four sides as the multiple sides with the one additional side for a load lock chamber.

In some embodiments, the process module can be a multiple-chamber module having three or more reaction chambers, wherein a single- and multiple-chamber module-attachable wafer-handling chamber, comprising: (I) a wafer-handling main chamber having a polygonal shape having multiple sides for connecting process modules thereto, respectively, and one additional side for a load lock chamber, wherein each process module has a single reaction chamber or multiple reaction chambers, and each of the multiple sides has a single opening for communicating with the process module connected thereto and has a width sufficient to accommodate multiple reaction chambers; (II) a wafer-handling robot installed inside the wafer-handling main chamber for transferring wafers between chambers connected to the wafer-handling main chamber, said wafer-handling robot being accessible to each of the chambers connected to the wafer-handling main chamber; and (III) adaptors for connecting the respective process modules to the wafer-handling main chamber, each adaptor having an inner face and an outer face, wherein the inner faces are detachably attached to the multiple sides of the wafer-handling main chamber, respectively, and the outer faces are adapted to detachably attach the process modules thereto, respectively, and each adaptor has a single opening for the process module having a single reaction chamber or multiple openings for the process module having multiple reaction chambers so that wafers can be transferred using the wafer-handling robot between the wafer-handling main chamber and the process modules through the openings of the adaptors and the openings of the multiple sides of the wafer-handling main chamber when the process modules are connected to the multiple sides of the wafer-handling main chamber, respectively, via the respective adaptors.

In another aspect, the present invention provides a wafer-processing apparatus, comprising: (a) any of the single- and dual-chamber module-attachable wafer-handling chambers disclosed in this disclosure or equivalents thereto, and process modules attached to the adaptors, respectively. In some embodiments, the wafer-processing apparatus further comprises a load lock chamber attached to the one additional side of the wafer handling chamber.

In still another aspect, the present invention provides an adaptor for connecting a process module having a single reaction chamber or dual reaction chambers to a wafer-handling main chamber having multiple sides, to one of which the process module is connected, and said one of which has a single opening for communicating with the process module connected thereto and has a width sufficient to accommodate two reaction chambers, wherein the adaptor has an inner face and an outer face, wherein the inner face is detachably attachable to the one side of the wafer-handling main chamber, and the outer face is detachably attachable to the process module, said adaptor having a single opening for the process module having a single reaction chamber or two openings for the process module having dual reaction chambers so that a wafer can be transferred between the wafer-handling main chamber and the process module through the opening of the adaptor and the opening of the one side of the wafer-handling main chamber. In some embodiments, the outer face is inclined for attaching the process module thereto at an angle other than a right angle, said angle being defined by an axis of the process module and the inner face of the adaptor as viewed from above.

The disclosed embodiments are explained with respect to the drawings below. However, the present invention is not limited to the disclosed embodiments or the drawings.

FIG. 1 is a schematic plan view of a wafer-processing apparatus combining four process modules 1 a, 1 b, 1 c, 1 d (each provided with two reactors 2), a wafer in/out chamber 5, and a wafer-handling main chamber 4 provided with a back end robot 3 (a wafer handling robot), desirably in conjunction with controls programmed to conduct process sequences. The process modules 1 a, 1 b, 1 c, and 1 d are connected to the wafer-handling main chamber 4 via adaptor 10 a, 10 b, 10 c, and 10 d, respectively. Each adaptor is provided with a gate valve 9 for each opening of the adaptor. In this embodiment, the wafer-processing apparatus comprises: (i) eight reactors 2 (RC1 to RC8) for processing wafers on the same plane, constituting four discrete process modules (units) 1 a, 1 b, 1 c, 1 d, each module 1 having two reactors 2 arranged side by side with their fronts aligned in a line; (ii) a wafer-handling train chamber 4 including a back end robot with dual arms, each having two end-effectors accessible to the two reactors of each unit simultaneously, said wafer-handling main chamber 4 having a polygonal shape having four sides corresponding to and being attached to the four process modules 1 a, 1 b, 1 c, 1 d, respectively, and one additional side for a wafer in/out chamber (load lock chamber) 5, all the sides being disposed on the same plane; (iii) adaptors 10 a, 10 b, 10 c, and 10 d connecting the process modules 1 a, 1 b, 1 c, and 1 d to the multiple sides of the wafer-handling main chamber 4, respectively; and (iv) a wafer in/out chamber 5 for loading or unloading two wafers simultaneously, said wafer in/out chamber 5 being attached to the one additional side of the wafer-handling chamber, wherein the back end robot 3 is accessible to the wafer in/out chamber 5. The interior of each reactor 2 and the interior of the wafer in/out chamber 5 can be isolated from the interior of the wafer handling chamber 4 by the gate valve 9. The wafer in/out chamber 5 is connected to a front end robot (FERB) 7 in an equipment front end module (EFEM) 6 based on a distribution status of wafers stored in loading ports (LP) 8 and a load lock chamber (LLC) 5, wherein the back end robot (BERB) 3 and the gate valves (GV) 9 are controlled sequentially using a program.

A skilled artisan will appreciate that the apparatus includes one or more controller(s) including the sequencer (not shown in FIG. 1) programmed or otherwise configured to cause the deposition and reactor cleaning processes described elsewhere herein to be conducted. The controller(s) will be communicated with the various power sources, heating systems, pumps, robotics and gas flow controllers or valves of the reactor, as will be appreciated by the skilled artisan. The process sequence can be controlled by any suitable methods including the method disclosed in a co-pending U.S. patent application Ser. No. 13/154,271, the disclosure of which is herein incorporated by reference in its entirety.

In the above embodiment, the wafer-handling main chamber 4 is pentagonal. However, the wafer-handling main chamber can have a polygonal shape having 2, 3, 4, 5, or 6 sides, for example, corresponding to and being attached to 2, 3, 4, 5, or 6 discrete process modules, respectively, and one additional side for a load lock chamber.

FIG. 2 schematically illustrates various adaptors attachable to a wafer-handling main chamber according to some embodiments. A wafer-handling main chamber 22 schematically illustrates a conventional wafer-handling main chamber having two openings 21 a, 21 b on a side (an opening 21 c on an adjacent side is partially shown), to which a dual chamber process module having two reactors is attached without an adaptor. Since the one side of the wafer-handling main chamber is designed to receive only a standardized process module, a nonstandardized process module, differently standardized module, single chamber process module, or the like may not be able to be connected to the wafer-handling main chamber. In an embodiment of the present invention, a wafer-handling main chamber 24 has one opening 23 on a side which has a width sufficient to accommodate two reactors so that either a single-chamber process module or a dual-chamber process module can be connected to the side of the wafer-handling main chamber 24. An adaptor 26 has two openings 25 a, 25 b for a dual chamber process module as illustrated in FIG. 1. In FIG. 2, a gate valve is omitted from the adaptor, which gate valve is typically provided on the inner face of the adaptor to close and open the opening of the adaptor. Alternatively, in some embodiments, a gate valve is provided to the side of the wafer-handling main chamber or the single- or dual-chamber process module, wherein the adaptor has no gate valve and functions as a single/double chamber-switching adaptor, a chamber angle-adjusting adaptor, and/or a chamber sealing adaptor.

FIG. 11 is a schematic view illustrating connection between a wafer-handling main chamber 113 and a dual-chamber module 117 via an adaptor 116 according to an embodiment of the present invention, wherein the adaptor 116 has two openings 111, each being provided with a gate valve 114 controlled through a support 112. The adaptor 116 is adapted to be connected to an opening 115 of the wafer-handling main chamber 113 and is also adapted to be connected to openings 118 of the dual-chamber process module 117. FIG. 12 is a schematic view illustrating connection between a wafer-handling main chamber 113 and a dual-chamber process module 127 via an adaptor 126 according to another embodiment of the present invention, wherein the adaptor 126 has two openings 111 without a gate valve. A gate valve 124 is provided to each opening 121 of the dual-chamber process module 127 and is controlled through a support 122 (i.e., the dual-chamber process chamber, in place of the adaptor, is equipped with the gate valves 124). The adaptor 126 is adapted to be connected to an opening 115 of the wafer-handling main chamber 113 and is also adapted to be connected to the openings 121 of the dual-chamber process module 127.

The adaptor can be attached to the side of the wafer-handling main chamber using threads or by a clamping mechanism using ribs provided around the edges of the adaptor, wherein an O-ring is inserted therebetween. In a similar way or any suitable conventional manner for attaching the process module to the side of the wafer-handling main chamber, the process module can be attached to the adaptor. A skilled artisan would readily appreciate attaching mechanisms and install such mechanisms to the adaptor based on common knowledge and routine experimentation.

An adaptor 28 has a single opening 27 and an inner face to be attached to the one side of the wafer-handling main chamber, in place of the adaptor 26, and an outer face to which a single chamber process module is attached. The single opening 27 can be disposed in a center of the adaptor or can be disposed aside from the center, with various opening sizes, depending on the size and standard of the process module and the type of the module.

In some embodiments, the adaptor has an inclined outer face so that the axis of the process module need not be always perpendicular to the side of the wafer-handling main chamber and can be angled relative to the side of the wafer-handling main chamber. In FIG. 2, an adaptor 30 has a single opening 29 for a single chamber process module, wherein the single opening 29 is disposed in a center. The outer face of the adaptor 30 is inclined wherein a thickness of one end of the adaptor 30 is thicker than that of another end of the adaptor 30. An adaptor 32 also has a single opening 31 for a single-chamber process module, but the single opening 31 is disposed close to an end whose thickness is greater than that of another end. Such an angled adaptor need not have a continuous inclined face from one end to the other end of the adaptor, but can have an inclined portion only where a process module is attached. The angled adaptor can be used for both a single-chamber process module and a dual-chamber process module.

In some embodiments, the adaptor can be made of an aluminum alloy (e.g., A-5052, 5058, 6061) or any other suitable alloy, aluminum, stainless steel, etc. In some embodiments, the average thickness of the adaptor may be about 50 mm to about 100 mm. In some embodiments, for an angled adaptor, the smallest thickness may be about 50 mm and the greatest thickness may be about 300 mm. In some embodiments, for a flat adaptor (having a uniform thickness from one end to the other end of the adaptor), the thickness may be about 50 mm to about 100 mm.

In FIG. 1, the process modules are CND process modules. However, since the adaptor can interface between the process modules and the wafer-handling main chamber, various process modules can be attached to the same wafer-handling main chamber (as a common platform) without making substantial modifications to the wafer-handling main chamber or to the process modules. For example, a module for epitaxy or epitaxial growth uses a lamp to heat a wafer so that it uses a quartz chamber with reinforcing structures and a cooling mechanism, requiring more space than a module for CVD or ALD. As a result, the module for epitaxy is typically a single-chamber module. By using the adaptors, a dual-chamber module for CVD or ALD can be installed on one side of the wafer-handling main chamber via an adaptor with two openings, and a single-Chamber module for epitaxy can be installed on another side of the wafer-handling main chamber via an adaptor with one opening. In some embodiments, the process module, which includes a plasma-enhanced CVD chamber, thermal or plasma-enhanced ALD chamber, wet or dry etching chamber, annealing chamber, UV-treatment chamber, pre-cleaning chamber, low-pressure CVD chamber, photo CVD chamber, epitaxial growth chamber, and chamber for other physical and/or chemical wafer-processing, or any other process, wherein a wafer is entirely included in a reaction chamber of the module for the intended purpose, can be installed to the wafer-handling main chamber via adaptors, regardless of whether the module is of a single-chamber type or a dual-chamber type.

When a process module such as a module for epitaxy has a great depth due to its heating mechanism and gas flow mechanism, the module next to the load lock chamber is close to the equipment front end module (EFEM) and interferes with maintenance work or is too close to the EFEM to be installed. In such an event, by using an angled adaptor, the axis of the module can be moved away from the EFEM so that the module can be installed or a space for maintenance work can be secured. FIG. 8 is a schematic view of a wafer-processing apparatus according to an embodiment of the present invention. In this figure, the wafer-processing apparatus comprises a pentagonal wafer-handling main chamber 38, a load lock chamber (LLC) 5 attached to an additional side of the wafer-handling main chamber 38, and four process modules attached to multiple sides of the wafer-handling main chamber 38 via adaptors. Each module is of a single-chamber type for epitaxy, for example. Each adaptor has one opening disposed aside from its center (all of the openings are disposed on the left side of the adaptors), and two adaptors are flat adaptors, and two adaptors are angled adaptors. The process module 35 a is attached to a side 38 a of the wafer-handling main chamber 38 next to the LLC 5 using an angled adaptor 41 so that an axis L1 of the process module 35 a is parallel to the EFEM 6 so as to make a space for the process module regardless of the length of the process module. The outer face of the angled adaptor 41 is inclined for attaching the process module thereto at an angle b2 (72°) which is smaller than a right angle (b1), wherein the angle is defined by the axis L1 of the process module and the inner face of the adaptor as viewed from above. In this embodiment, the outer face of the angled adaptor 35 a has an angle of (90°−b2=18°). The process module 35 b next to the process module 35 a is attached to another side 38 b of the wafer-handling main chamber 38 via a flat adaptor 40. The angle defined by a line L2 perpendicular to the side 38 b of the wafer-handling main chamber 38 and a line L3 perpendicular to the side 38 a of the wafer-handling main chamber 38 as viewed from above is a1 which is 72°. The angle defined by the axis L1 of the process module 35 a attached to the side 38 aof the wafer-handling main chamber 38 and the axis L2 of the process module 35 b attached to the side 38 b of the wafer-handling main chamber 38 as viewed from above is a2 (54°) which is smaller than a1 (72°). Although a2 is smaller than a1, the space between the process modules 35 a, 35 b are sufficient for maintenance work. The angle of the angled adaptor can be in a range of about 5° to about 45° (typically 10° to about 30°) in some embodiments.

FIG. 4 is a schematic view of a wafer-processing apparatus according to an embodiment of the present invention. The configuration of this apparatus is identical to that of the apparatus illustrated in FIG. 8, but this figure shows wafers and wafer-handling robot arms. In this figure, since the adaptors 40, 41 have openings disposed on the left side aside from the center, the wafer-handling robot has a half-U-shaped top arm 36 connected to an end effector. FIG. 3 is a schematic view of a wafer-processing apparatus according to another embodiment of the present invention wherein adaptors 39 are angled adaptors having openings at the center. In this figure, since the adaptors 39 have openings disposed at the center, the wafer-handling robot has a straight top arm 37 connected to an end effector. It should be noted that although the process module 35 has a depth greater than a width, a pedestal for supporting a wafer W is close to the front opening as illustrated in FIG. 5. FIG. 5 is a schematic view of a process module attached to an adaptor wherein a half-U-shaped top arm is inserted according to an embodiment of the present invention. In this figure, a pedestal 52 is disposed close to the front opening of the process module 35 connected to an adaptor 41 which is provided with a gate valve 51 inside the adaptor on the outer face side. A half-U-shaped top arm 36 supporting a wafer W is in a loading/unloading position.

FIG. 6 schematically illustrates movement of a half-U-shaped top arm in a reaction chamber attached to a wafer-handling main chamber using a flat adaptor having an opening on the right side ((a) in FIG. 6) and in a reaction chamber attached to a wafer-handling main chamber using an angled adaptor having an opening on the right side ((b) in FIG. 6) according to an embodiment of the present invention. This figure illustrates movement in relation to the related structures, and actual structures of the adaptor and the process module are omitted for easier understanding. In (a) of FIG. 6, a half-U-shaped top arm 61 a, to which an end effector 62 supporting a wafer W1 is attached is rotatably connected to a middle arm 61 b which is rotatably connected to a lower arm 61 c. Since this is a dual-arm robot, there is a second half-U-shaped top arm 63 a, to which an end effector 64 supporting a wafer W2 is attached, which is rotatably connected to a middle arm 63 b which is rotatably connected to a lower arm 63 c. In this figure, the top arm of the wafer-handling robot is configured to move in a straight line perpendicular to a side of the wafer-handling main chamber, and thus, when the half-U-shaped top arm 61 a has a length L which is a length between a pivot point connected to the middle arm 61 b and a center of the distal end attached to the end effector 62, and the length L is equivalent to a distance from the edge of a reaction chamber 65 to the center of the reaction chamber 65, the center of the distal end attached to the end effector 62 travels along the center of the reaction chamber 65 by operating the wafer-handling robot in the same manner as for a dual-chamber module using a U-shaped arm. Since the edges of the wafer W1 move along lines 66, the reaction chamber 65 must have a front opening wider than a diameter of the wafer O1. When the wafer W1 is located a position which is at a depth D1 from the opening, the wafer W1 is loaded/unloaded.

In (b) of FIG. 6, since the angled adaptor is used, a reaction chamber 67 is also angled, i.e., the front opening is not parallel to the side of the wafer-handling main chamber. In this figure, in order to move the end effector 62 to the loading/unloading position, the half-U-shaped top arm 61 a needs to move forward by a depth D2 which is more than the depth D1. Further, since the front opening of the reaction chamber 67 is angled, the edge of the wafer W1 is closer to the edge of the reaction chamber 67 as compared with the configuration of (a) of FIG. 6, requiring the front opening having a width O2 (if it is symmetrical). In view of the above, when the adaptor is an angled adaptor, the process module may need to be modified so that the reaction chamber has a wider front opening. In some embodiments, the length L is equivalent to a half of the width of the reaction chamber (or 10% to 80% of the width of the reaction chamber). In some embodiments, the half-U-shaped arm may be modified to be a curved arm, L-shaped arm, S-shaped arm, elbow-shaped arm, etc., whose shape is fixed (the arm is rigid). In some embodiments, even when the angled adaptor is used, depending on the type and function of the wafer-handling robot, a straight top arm can be used.

FIG. 7 schematically illustrates movement of a half-U-shaped top arm in a wafer-handling main chamber ((a1) in FIG. 7) and in a reaction chamber attached to a wafer-handling main chamber using a flat adaptor having an opening on the right side ((a2) in FIG. 7), and movement of a U-shaped top arm in a reaction chamber attached to a wafer-handling main chamber using a flat adaptor having two openings ((b) in FIG. 7) according to an embodiment of the present invention. In (a1) and (a2) of FIG. 7, the wafer-handling robot is the same as that illustrated in FIG. 6. When the wafer-handling robot is at a standby position or rotates inside the water-handling main chamber to be positioned at a designated process module, the top arms 61 a, 63 a overlap as viewed from above as illustrated in (a1) of FIG. 7. The movement in (a2) of FIG. 7 is for loading or unloading the wafer W1 as illustrated in (a) of FIG. 6. When the wafer-handling robot has a dual arm 71 a, 73 a, i.e., a U-shaped arm, the dual arm moves simultaneously into and out of two reaction chambers 74, 75. In the above, the same wafer-handling robot can be used for dual-chamber modules and for single-chamber modules, except that the top arm is changed wherein a half-U-shaped top arm is installed for single-chamber modules, whereas a U-shaped top arm is installed for dual-chamber modules.

FIG. 9 illustrates schematic views of an adaptor according to an embodiment of the present invention, wherein (a), (b), and (c) are a rear perspective view (partially transparent), cross section taken along line b, and front perspective view of the adaptor, respectively. As illustrated in FIG. 9, in some embodiment, a gate valve 94 is provided inside (i.e., in the interior of) an adaptor 91. The adaptor 91 has an opening 93 a facing a wafer-handling chamber and an opening 93 b facing a reaction chamber, and the gate valve 94 is provided on the wafer-handling chamber side to close the opening 93 a. The gate valve 94 is supported by a shaft 95 driven by air pressure, and moves vertically to close and open the opening 93 a. Drive air is supplied through a support 92 of the adaptor 91. Alternatively, the gate valve can be driven using an electrical device or any other suitable mechanism. The adaptor has a rib 96 on a side where a thickness is greater than that of another side 97 which is sufficiently thin to function as a rib. The ribs are used to attach the adaptor to the wafer-handling chamber using a clamping mechanism, for example. Alternatively, the adaptor can be attached to the wafer-handling chamber using screws or any other suitable mechanism.

FIG. 10 is a schematic partial view of a connecting portion of an adaptor which is attached to a wafer-handling chamber according to an embodiment of the present invention. The adaptor 102 has a portion 106 having a rib attached to a side edge of one side of a wafer-handling chamber 101 using a clamp 103 so that an opening 105 of the adaptor 102 is aligned with an opening of the side of the wafer-handling chamber 101. The adaptor 102 also has pins 104 for aligning a reaction chamber.

A skilled artisan will appreciate that the movement of the wafer-handling robot can readily be programmed wherein signals of control parameters such as rotation angle, extending movement, retracting movement, etc. of the arm are provided to the wafer-handling robot from a controller. Also, a skilled artisan will appreciate that the sequences of the movement of the wafer-handling robot as to where and when an unprocessed wafer is loaded and unloaded and where and when a processed wafer is loaded and unloaded can readily be controlled by the controller.

In the above, the adaptor systems for adapting single- or dual-chamber modules are discussed; however, the adaptor system can be applied to adapt single- or multiple-chamber modules which can have three or more reaction chambers. Also, the adaptor system can be applied to adapt multiple-chamber modules which have two or more reaction chambers disposed not only side by side but also vertically.

It will be understood by those of skill in the art that numerous and various modifications can be made without departing from the spirit of the present invention. Therefore, it should be clearly understood that the forms of the present invention are illustrative only and are not intended to limit the scope of the present invention. 

We/I claim:
 1. A single- and dual-chamber module-attachable wafer-handling chamber, comprising: a wafer-handling main chamber having a polygonal shape having multiple sides for connecting process modules thereto, respectively, and one additional side for a load lock chamber, wherein each process module has a single reaction chamber or dual reaction chambers, and each of the multiple sides has a single opening for communicating with the process module connected thereto and has a width sufficient to accommodate two reaction chambers; a wafer-handling robot installed inside the wafer-handling main chamber for transferring wafers between chambers connected to the wafer-handling main chamber, said wafer-handling robot being accessible to each of the chambers connected to the wafer-handling main chamber; and adaptors for connecting the respective process modules to the wafer-handling main chamber, each adaptor having an inner face and an outer face, wherein the inner faces are detachably attached to the multiple sides of the wafer-handling main chamber, respectively, and the outer faces are adapted to detachably attach the process modules thereto, respectively, and each adaptor has a single opening for the process module having a single reaction chamber or two openings for the process module having dual reaction chambers so that wafers can be transferred using the wafer-handling robot between the wafer-handling main chamber and the process modules through the openings of the adaptors and the openings of the multiple sides of the wafer-handling main chamber when the process modules are connected to the multiple sides of the wafer-handling main chamber, respectively, via the respective adaptors.
 2. The single- and dual-chamber module-attachable wafer-handling chamber according to claim 1, wherein all of the adaptors have a single opening.
 3. The single- and dual-chamber module-attachable wafer-handling chamber according to claim 2, wherein the single opening is disposed in a center of each adaptor.
 4. The single- and dual-chamber module-attachable wafer-handling chamber according to claim 2, wherein the single opening is disposed aside from a center of the each adaptor.
 5. The single- and dual-chamber module-attachable wafer-handling chamber according to claim 1, wherein all of the adaptors have dual openings.
 6. The single- and dual-chamber module-attachable wafer-handling chamber according to claim 5, wherein the dual openings are disposed symmetrically.
 7. The single- and dual-chamber module-attachable wafer-handling chamber according to claim 1, wherein the outer face of at least one adaptor is inclined for attaching a process module thereto at an angle other than a right angle, said angle being defined by an axis of the process module and the inner face of the adaptor as viewed from above.
 8. The single- and dual-chamber module-attachable wafer-handling chamber according to claim 7, wherein at least one adaptor has a uniform thickness from one end of the adaptor to another end of the adaptor as viewed from above.
 9. The single- and dual-chamber module-attachable wafer-handling chamber according to claim 7, wherein an angle defined by an axis of the process module attached to one of the multiple sides of the wafer-handling main chamber and an axis of the process module attached to another of the multiple sides of the wafer-handling main chamber next to the one of the multiple sides of the wafer-handling main chamber as viewed from above, is smaller than an angle defined by a line perpendicular to the one of the multiple sides of the wafer-handling main chamber and a line perpendicular to the another of the multiple sides of the wafer-handling main chamber as viewed from above.
 10. The single- and dual-chamber module-attachable wafer-handling chamber according to claim 2, wherein the wafer-handling robot has a half-U-shaped top arm connected to an end effector.
 11. The single- and dual-chamber module-attachable wafer-handling chamber according to claim 5, wherein the wafer-handling robot has a U-shaped arm having ends connected to end effectors, respectively.
 12. The single- and dual-chamber module-attachable wafer-handling chamber according to claim 1, wherein the wafer-handling robot is a double arm robot.
 13. The single- and dual-chamber module-attachable wafer-handling chamber according to claim 1, wherein each adaptor is provided with a gate valve on the inner surface for closing and opening the opening of the adaptor.
 14. The single- and dual-chamber module-attachable wafer-handling chamber according to claim 1, wherein each adaptor has an average thickness of about 50 mm to about 100 mm.
 15. The single- and dual-chamber module-attachable wafer-handling chamber according to claim 1, wherein the adaptors are made of an aluminum alloy, and the process modules are not connectable to the wafer-handling main chamber without the adaptors.
 16. A single- and multiple-chamber module-attachable wafer-handling chamber comprising: a polygonal wafer-handling main chamber equipped with a wafer-handling robot therein, and adaptors for connecting process modules to the wafer-handling main chamber, wherein the adaptors are detachably attached to sides of the wafer-handling main chamber, respectively, and the process modules are detachably attached to the adaptors, respectively, so that the process modules can be attached to the wafer-handling main chamber, regardless of whether the process modules are of a single-chamber type or dual-chamber type.
 17. A wafer-processing apparatus, comprising: the single- and dual-chamber module-attachable wafer-handling chamber of claim 1, and process modules attached to the adaptors, respectively.
 18. The wafer-processing apparatus according to claim 17, further comprising a load lock chamber attached to the one additional side of the wafer-handling chamber.
 19. An adaptor for connecting a process module having a single reaction chamber or dual reaction chambers, to a wafer-handling main chamber having multiple sides, to one of which the process module is connected, and said one of which has a single opening for communicating with the process module connected thereto and has a width sufficient to accommodate two reaction chambers, wherein the adaptor has an inner face and an outer face, wherein the inner face is detachably attachable to the one side of the wafer-handling main chamber, and the outer face is detachably attachable to the process module, said adaptor having a single opening for the process module having a single reaction chamber or two openings for the process module having dual reaction chambers so that a wafer can be transferred between the wafer-handling main chamber and the process module through the opening of the adaptor and the opening of the one side of the wafer-handling main chamber.
 20. The adaptor according to claim 19, wherein the outer face is inclined for attaching the process module thereto at an angle other than a right angle, said angle being defined by an axis of the process module and the inner face of the adaptor as viewed from above. 